Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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Pune-headquartered automotive component supplier Varroc Engineering and French battery system manufacturer Forsee Power have joined forces to produce electric vehicle battery packs in India.

Under the terms of the transaction, Varroc will acquire a 45 percent equity stake in Forsee Power's Indian subsidiary, Forsee Power India and will assume management and operational control of the entity.

Varroc will also subscribe to Optionally Convertible Redeemable Preference Shares to provide growth capital for the joint venture, subject to regulatory and corporate approvals. The joint venture will initially focus on battery pack development for three-wheeled electric vehicles, before expanding into two-wheelers, light commercial vehicles, buses, trucks and industrial equipment.

The agreement combines Forsee Power's battery system architecture and software with Varroc's component manufacturing, engineering infrastructure and vehicle manufacturer supply relationships across domestic assembly operations.

Arjun Jain, Whole Time Director and CEO – Business I, Varroc, said, "Electric mobility is both evolving and growing rapidly, thus creating new opportunities and new requirements for the automotive industry. Through this evolution we believe OEMs will need partners who can anticipate changes and translate them into reliable, cost-effective solutions at scale. Our partnership with Forsee Power brings together complementary strengths in battery-system technology, automotive engineering, manufacturing and customer relationships. It represents an important step in expanding Varroc’s portfolio to address the evolving needs of our market and the future of mobility. This will further enhance addressable content per electric vehicle in all the segment."

Christophe Gurtner, Chairman and CEO, Forsee Power, said, "With the rapid growth of electric mobility adoption in India, the opportunity is clear and we are ready to scale. Joining forces with Varroc combines our battery technology with local industrial strength and customer access. Three-wheelers are our starting point, with a clear ambition to expand across two-wheeler, commercial and industrial vehicles."

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German technology company AUMOVIO will showcase a portfolio of braking, rider assistance and connectivity solutions for motorcycles and powersports vehicles at EICMA 2026 in Milan, scheduled from 3 to 8 November 2026.

The company's showcase centres on the launch of the MK 120 MAB brake system, which extends AUMOVIO's braking product line beyond two-wheeled applications. The system is engineered for three-wheeled scooters, side-by-side vehicles, utility terrain vehicles and all-terrain vehicles.

It integrates vehicle stability functions derived from passenger car and motorcycle architectures, including active yaw control and wheel lift mitigation, to assist vehicle control across varied terrain.

In addition to the MK 120 MAB, AUMOVIO will display its Motorcycle ABS 2.3 Base unit featuring an optional inertial measurement unit, alongside the MiniMAB EVO system designed for small-displacement scooters and commuters.

The company's display also features radar sensors for adaptive cruise control and blind-spot detection, digital instrument clusters ranging from 4 to 8.8 inches, a standalone Connected Infotainment Box and automated manual transmission control units.

The hardware, software and electronic systems on display utilise automotive development, cybersecurity and production standards adapted to motorcycle and powersports operational environments.

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Auto component manufacturer Eastman Auto and Power has appointed Rajesh Jindal as Chief Executive Officer.

He comes with over 34 years of corporate experience spanning sales, marketing and product management, following a 24-year tenure at Amara Raja Energy and Mobility, where he most recently served as Chief Marketing Officer for automotive batteries in India.

Jindal holds a bachelor's degree in mechanical engineering alongside a Master of Business Administration qualification. During his career, he has managed distribution networks, channel partner relations and go-to-market strategies within the energy storage and automotive component sectors.

Shekhar Singal, MD, Eastman Auto and Power, said, "With over 34 years of experience, Jindal has garnered experience in sales, marketing and product development and is well-positioned to accelerate Eastman’s growth journey. As he begins this new chapter at Eastman, we look forward to his leadership in deepening our commitment for delivering sustainable value for our customers, partners, employees and stakeholders - advancing the company's long-term growth aspirations and inspiring the organisation to achieve new milestones together."

Established in 2000, Eastman Auto and Power operates across three business verticals: last-mile electric mobility solutions, residential solar storage systems and energy storage solutions.

The company employs over 3,600 personnel across seven manufacturing plants in India, supported by a distribution network of more than 1,200 direct partners and over 400 original equipment manufacturer clients worldwide.

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Kuraray America, Inc. (KAI) recently took part in the SAE International Thermal Management Systems Symposium, held on 6–7 October 2026 in Dearborn, Michigan. The event gathered mobility-industry professionals to discuss technologies and emerging challenges in vehicle thermal management. Throughout the two-day symposium, the Kuraray GENESTAR team connected with attendees at Booth #19, sharing insights into high-performance engineering materials.

The team demonstrated how GENESTAR PA9T can meet demanding automotive application requirements. This heat-resistant polyamide engineering plastic was developed by Kuraray using unique monomers, combining low water absorption, high heat resistance, chemical resistance, dimensional precision and excellent moldability. It also offers electrical properties suitable for demanding electrical and electronic applications, including low water absorption, chemical resistance, moldability, insulation performance, thermal resistance and dimensional stability.

These characteristics make GENESTAR relevant for a broad range of electrical, electronic and automotive components. Kuraray lists automotive applications including connectors, relays, insulators and wire harnesses, while GENESTAR materials also serve in sliding, fuel and air-intake systems. The company reports use in automotive gears, bearings, piping and intercooler tanks, and the material is being considered for electric-vehicle applications as well.

The SAE symposium provided a forum for exchanging insights into evolving thermal management technologies. The 2026 programme covered battery and electronics cooling, climate control, alternative refrigerants and vehicle thermal engineering approaches. For Kuraray, participation enabled direct engagement with engineers and industry professionals about how high-performance materials can address increasingly complex automotive design requirements, with GENESTAR PA9T offering a material option where multiple performance demands must be met simultaneously.

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