Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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German multinational chemical company Henkel has announced the appointment of Pradhyumna Ingle as Country President for India. Based in Navi Mumbai, he will lead the company’s growth strategy, market expansion and innovation initiatives.

Pradhyumna will balance his new responsibilities with his existing global leadership roles within Henkel Adhesive Technologies, where he serves as: Global Head – Infrastructure Protection & Repair and IMEA Head – Manufacturing & Maintenance.

He succeeds S. Sunil Kumar, who has led Henkel India for the past five years and will now relocate to Dubai to oversee strategic projects for the IMEA region alongside his duties as Director of Packaging for IMEA.

The company says Pradhyumna comes with over 25 years of leadership experience across multiple regions, including the Asia Pacific, North America and the Middle East & Africa. He has rich experience in driving acquisitions, digital business models and high-performance organisations.

Ashraf Elafifi, IMEA President, Henkel, said, “Pradhyumna brings a unique combination of global perspective, deep market understanding, customer-centricity, and proven leadership in driving transformation and sustainable growth.”

Pradhyumna highlighted the potential of the Indian market, noting that Henkel is positioned to contribute to sectors such as infrastructure, mobility, electronics and energy.

“I am excited to work with our talented teams across India to further strengthen our market position, expand our local innovation capabilities, and deliver sustainable growth for our customers, employees, partners, and communities,” said Pradhyumna.

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Switzerland-based international technology and market leader in electrolamination stamping, fineblanking and forming company Feintool has officially inaugurated its first manufacturing site in India, located in Pune.

The facility, which has begun ramping up production, is designed to support the local automotive market with high-precision fineblanked components. The company had earmarked an initial investment of CHF 15 million (approx USD 19 million) towards the facility, which will produce seat adjusters for various major automotive manufacturers in India.

The company has adopted a ‘local-for-local’ approach, allowing it to supply automotive customers directly within the Indian market. This move is intended to reduce reliance on long-distance supply chains and respond to the growth of India’s automotive sector, which is the third-largest in the world.

Lars Reich, CEO, Feintool, said, “Feintool is proud to meet its customers’ demand for local production in India with the facility in Pune. We are in the right place at the right time to benefit sustainably from the momentum in the Indian automotive industry and to capitalise on further opportunities in the growing industrial markets in India.”

Initial operations at the Pune site are focused on the production of fine-blanked automotive seating systems. However, the facility is designed to support future expansion into additional core technologies, including cold forming, e-lamination stamping (for e-motor cores) and hydrogen applications.

Tobias Gries, Managing Director, Feintool India, said, “We have established a strong team in India. With Feintool’s global expertise, we are now ramping up production in Pune—starting with fineblanked automotive seating systems. Looking ahead, we are ready to expand into cold forming, e-motor core production and even hydrogen applications. The plant is fully prepared for further expansion as demand develops.”

This new site joins Feintool’s network of 18 production facilities across Europe, Asia, and the United States.

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BOS and JRG Automotive Industries India have formed a new joint venture christened ‘BOS-JRG Automotive Systems’, which combines engineering and manufacturing resources. The partnership aims to supply shading and cargo management systems to the Indian automotive market.

As per the understanding, the new JV will see BOS hold a 60 percent stake in the venture, while JRG Automotive will hold 40 percent. The partners have made an initial investment of over USD 1 million, with an aim to generate USD 15 million in revenue within five years.

The partners have established a manufacturing facility in Bawal, Haryana, which went on stream on 10 June 2026. This site utilises production lines based on BOS systems, supported by the tooling, injection moulding and supply chain network provided by JRG. Series production is scheduled to begin in December 2026. The initial product range includes side window sunshades and tonneau covers, with plans to expand into other interior and mechatronic systems.

Pawan Goyal, Managing Director, JRG Automotive Industries India, said, "This partnership reflects our shared vision of building a world-class automotive systems company in India, combining global technology, strong localisation and a commitment to long-term value creation for customers."

Nicolaus Francke, Director, BOS-JRG Automotive Systems, added, "BOS-JRG is a strategic step towards bringing global innovation closer to the Indian market, creating a strong foundation for sustainable growth, localisation and future mobility solutions."

The venture plans to support the production requirements of passenger vehicle manufacturers in India through technology transfer and local manufacturing.

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Tsuyo Manufacturing Private Limited (Tsuyo), India’s leading e-mobility component manufacturing company and a pioneer in integrated electric vehicle powertrain technologies, has earned a place among 120 startups selected for Bharat Innovates 2026. This flagship initiative is overseen by India’s Ministry of Education and aims to identify and support the nation’s most promising technology ventures.

The selection underscores Tsuyo’s rising contribution to the domestic electric mobility sector, particularly through the development of advanced powertrain solutions. By focusing on indigenous capabilities, the company supports India’s goal of self-reliance in clean mobility and assists original equipment manufacturers in accelerating electric vehicle adoption across multiple vehicle categories.

Bharat Innovates 2026 will take place in Nice, France, from 14 to 16 June. Announced by Prime Minister Narendra Modi on 17 February 2026 during the India-France Year of Innovation, the programme is designed to mentor high-potential startups and showcase them globally. Through this platform, Tsuyo will gain mentorship, networking opportunities and international visibility to further expand its technological reach.

With two manufacturing plants in Greater Noida and over 200,000 motors sold to more than 50 original equipment manufacturers, Tsuyo leads the mid-drive electric motor segment in India. Its products serve three-wheelers, light commercial vehicles, medium and heavy commercial vehicles and off-road applications, with powertrain systems ranging from 0.5 kW to 400 kW. Continued investment in research and development keeps the company committed to India’s sustainability and manufacturing ambitions.

Vijay Kumar, Founder & CEO, Tsuyo Manufacturing Private Limited, said, "This milestone is the advocacy of the incessant effort of the entire Tsuyo team. It affirms our vision of developing globally advanced, adaptable and affordable EV powertrain technologies that are both designed and manufactured in India. As the nation accelerates its shift towards sustainable mobility, indigenous innovation will be the right pivot towards enhancing supply chain resilience, reducing technological dependence and positioning India as a global hub for electric mobility. We are eager to utilise this platform to highlight India's engineering prowess and engage with global stakeholders who share our commitment to sustainable transportation.”

Lalit Baid, Founder & COO, Tsuyo Manufacturing Private Limited, said, "Bharat Innovates 2026 offers a unique opportunity for technology companies to collaborate, learn and expand. At Tsuyo, our focus has consistently been on developing high-performance, reliable and cost-effective powertrain solutions which must meet the evolving demands of the EV industry. A key pillar of our innovation is our work on sustainable motor manufacturing without rare-earth magnets – reducing dependence on critical mineral supply chains and eliminating the geopolitical risk that comes with China-dominated RE magnet sourcing. Participation in this initiative will enable us to further enhance our innovation roadmap, forge meaningful partnerships and contribute to India's goal of becoming a global leader in electric mobility technologies."

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