Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions, is set to fully acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for a consideration of up to EUR 42.5 million.

This move Tessolve claims will elevate it to be among a select group of design firms worldwide capable of delivering turnkey design solutions for complex cutting-edge chips. The acquisition will enable it to provide advanced capabilities in terms of System on Chip (SoC) designs for the Artificial Intelligence (AI), automotive, data centre, and industrial markets.

Furthermore, Tessolve will also strengthen its footprint in Europe by adding four delivery locations across Germany and Netherlands, including a specialised ADAS (Advanced Driver Assistance Systems) and imaging centre-of-excellence lab.

Srini Chinamilli, Co-Founder & CEO, Tessolve, said, “This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productisation capabilities. Dream Chip’s capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhances our European footprint.”

Dream Chip Technologies is said to be one of the leading semiconductor design service companies in Germany, particularly for its expertise in complex digital designs.

Jens Benndorf, CEO, Dream Chip Technologies, said, "We are excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. By combining our design capabilities and IP with Tessolve’s established semiconductor services and embedded solutions, we can offer our customers a truly end-to-end solution from chip architecture to post-silicon test and supply chain management for their most complex designs. Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications."

Ujjwal Munjal, Chairman, Tessolve, added, “Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market.”

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American tier 1 supplier BorgWarner has announced a significant 7-year contract extension with a world-leading off-highway manufacturer to supply 8 distinct families of controllers.

The agreement, which runs through December 2032, reinforces BorgWarner’s role as a primary propulsion partner for diverse heavy-duty applications, including construction machinery, marine platforms and stationary power systems.

The contract covers a comprehensive suite of control units designed for both traditional and electrified powertrains:

• Engine & Machine Controllers: Engineered to manage efficient combustion, minimise emissions in large diesel engines and precisely direct hydraulic and mechanical actuators for heavy equipment.
• Power Module & BMS Controllers: Designed for the OEM’s electric machines and battery management systems, supporting the industry's shift toward electrification.

This extension builds on a partnership spanning several decades. By supplying a broad portfolio that ranges from conventional diesel sensor management to advanced battery monitoring, BorgWarner continues to position itself as a versatile Tier 1 supplier capable of supporting the ‘multi-pathway’ technology transition in the off-highway sector.

Dr. Stefan Demmerle, President and General Manager, BorgWarner PowerDrive Systems, said, “BorgWarner has an outstanding relationship with this leading off-highway manufacturer, a customer we have been supplying critical parts to for several decades, and we are thrilled to continue to grow with them as their volumes increase for various market segments and applications. This contract expansion validates our position as a trusted, long-term propulsion partner that is agile enough to support them and provide tailored solutions as they expand into new, emerging markets.”

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Nexteer Automotive has announced that its Electro-Mechanical Brake (EMB) is ready for mass production following extensive development and validation. First introduced as a concept at Auto Shanghai 2025, the EMB completes Nexteer’s Motion-by-Wire portfolio, allowing the company to offer integrated steer-by-wire and brake-by-wire solutions.

The EMB system has undergone a year of rigorous testing, including simulations, bench tests and extreme winter performance validation. According to the company, more than 20 original equipment manufacturers (OEMs) have tested the product, with several projects now moving into technical co-development.

Nexteer is leveraging its historical expertise in steering to create a unified chassis control ecosystem. This approach offers several advantages for modern vehicle architectures:

• Software-Defined Safety: Nexteer’s ‘braking-steering fusion’ software provides cross-domain redundancy, a critical requirement for Level 3 and higher autonomous driving. The software features open interfaces for rapid integration into OEM-specific architectures.
• Hardware Efficiency: By platformising actuator modules – including motors, sensors, and ASIL-D microcontrollers – Nexteer is reusing hardware components across steering and braking systems to reduce costs and development timelines.
• Global Supply Chain: The company is utilising high supplier overlap between its steering and braking divisions to achieve economies of scale through centralised procurement.

Jun Li, Senior Vice-President and APAC Division President, Nexteer Automotive, said, “The integration of Nexteer’s Steer-by-Wire and EMB isn’t just a simple ‘1+1’ — it’s a natural evolution rooted in the fundamentals of mechatronics, and a key enabler for achieving both safety and cost-effectiveness in high-level autonomous driving. Choosing Nexteer means more than just picking up two components — it means getting a complete, proven, production-ready, and cost-effective chassis motion control solution.”

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Technology firm AUMOVIO and adhesive manufacturer tesa have entered a partnership to introduce a new mechanical integration solution for automotive displays.

The collaboration focuses on a robotic bonding process that allows for debonding-on-demand, a feature designed to facilitate repairs and recycling throughout a vehicle's life cycle.

The system utilises a 2 mm wide adhesive tape that is applied robotically, providing an immediate load-bearing bond without curing time. This narrow profile enables the manufacturing of ultra-thin display bezels similar to those found in smartphones.

Unlike traditional permanent adhesives, this bond can be selectively detached with minimal effort, allowing individual display components to be replaced or reworked during production or service without discarding the entire module.

The technology is engineered to compensate for material expansion across automotive temperature ranges while supporting circular economy principles. By enabling the recovery of valuable components at the end of a vehicle's service life, the solution aligns with AUMOVIO’s sustainability strategy. The partners are currently preparing to integrate this process into volume production during the second quarter of 2026.

Pavel Prouza, Head of the User Experience (UX) Business Area at AUMOVIO, said, “The combination of highly precise, automated application and targeted detachability adds an important element to our manufacturing and quality processes. It strengthens the robustness of our production, reduces material waste, and promotes efficient use of valuable components. For the end customer, this could even mean that future repairs may require replacing only the affected individual components in a cost-effective way.”

David Caro, Head of Automotive, tesa, said, “This partnership demonstrates how innovative materials technology is advancing the mobility of tomorrow. Together with AUMOVIO, we offer automated adhesive bonds that not only provide long-term durability but can also be deliberately debonded – enabling efficient production, longer product life cycles, and circular product concepts. This helps our customers translate their sustainability goals into tangible product solutions.”

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China’s WeRide has announced that at the Wuhu round of the Second China Urban Intelligent Driving Competition, the Chery Exeed Sterra ET, powered by the WeRide WRD 3.0 (jointly developed with Bosch), claimed first place with a lead of over 10 points.

As the first publicly traded Robotaxi company, WeRide operates in over 40 cities across 12 countries. It holds autonomous driving permits in eight major markets, including the UAE, Singapore and the US, providing L2 to L4 solutions across the mobility, logistics and sanitation sectors.

This win marks the first time in the competition's history that a single solution has achieved four consecutive championships, following previous victories in Taizhou, Wenzhou and Jinhua.

The WRD 3.0 system utilises a one-stage end-to-end ADAS solution designed to handle complex urban environments. Its performance is driven by two key internal technologies:

• GENESIS Simulation World Model: A proprietary platform that uses generative AI to reproduce rare ‘long-tail’ scenarios, bridging the gap between virtual training and real-world application.
• L4 Driverless Data Integration: The system leverages large-scale data from WeRide's fully driverless operations to refine perception and planning in dense traffic, such as street markets and mixed-use urban roads.

WeRide has transitioned WRD 3.0 from an algorithmic concept to a production-ready system, achieving hardware-software decoupling that allows it to run on different computing tiers.

With the launch of the Aion N60, WeRide has become the first autonomous driving provider to achieve mass production of one-stage end-to-end technology on both Nvidia Drive and Qualcomm Snapdragon platforms.

While strengthening its presence in China with brands like GAC Trumpchi and Hyptec, WeRide is expanding its international footprint. Through partnerships with Tiggo, Omoda and JAECOO, the company aims to export its intelligent driving solutions to global markets.

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