Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions, is set to fully acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for a consideration of up to EUR 42.5 million.

This move Tessolve claims will elevate it to be among a select group of design firms worldwide capable of delivering turnkey design solutions for complex cutting-edge chips. The acquisition will enable it to provide advanced capabilities in terms of System on Chip (SoC) designs for the Artificial Intelligence (AI), automotive, data centre, and industrial markets.

Furthermore, Tessolve will also strengthen its footprint in Europe by adding four delivery locations across Germany and Netherlands, including a specialised ADAS (Advanced Driver Assistance Systems) and imaging centre-of-excellence lab.

Srini Chinamilli, Co-Founder & CEO, Tessolve, said, “This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productisation capabilities. Dream Chip’s capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhances our European footprint.”

Dream Chip Technologies is said to be one of the leading semiconductor design service companies in Germany, particularly for its expertise in complex digital designs.

Jens Benndorf, CEO, Dream Chip Technologies, said, "We are excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. By combining our design capabilities and IP with Tessolve’s established semiconductor services and embedded solutions, we can offer our customers a truly end-to-end solution from chip architecture to post-silicon test and supply chain management for their most complex designs. Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications."

Ujjwal Munjal, Chairman, Tessolve, added, “Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market.”

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Bengaluru-headquartered AI fleet safety and performance solutions company Netradyne has announced the acquisition of Moove Connected Mobility, a European fleet intelligence and mobility company with presence across European markets.

The acquisition is part of Netradyne’s expansion and its strategy for the European region. By combining Netradyne’s platform with Moove’s presence, customer relationships and experience, the company aims to serve customers across the continent.

Moove will join Netradyne Europe, serving as a hub for regional sales, customer engagement, partnerships and market development. This structure allows Netradyne to increase growth in Europe while remaining close to customers, regulators, and partners.

Avneesh Agrawal, CEO and Co‑Founder, Netradyne, said, “Europe is a critical pillar of our global strategy. This acquisition reflects a clear commitment to building long‑term presence, leadership, and trust in the region. By bringing together Moove’s local expertise and relationships with Netradyne’s AI platform, we are uniquely positioned to support European fleets at scale while staying deeply anchored in the region.”

Moove’s leadership team has experience in the European regulatory and operational landscape for mobility. Jeroen Bruinooge, Former CEO of Moove Connected Mobility, will become SVP & GM, Europe at Netradyne. He will lead the European strategy, partnerships and customer success.

The teams will focus on solutions to help fleet operators with safety outcomes, driver performance, and operational insights. The acquisition also increases Netradyne’s ability to support customers seeking a platform across North America, Europe, and Asia. This move is part of Netradyne’s mission to build an AI company with investment in the markets it serves.

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Italian technology company Brembo has announced that its intelligent braking platform, Sensify, has entered commercial production for a major global vehicle manufacturer. The system is being fitted as standard across the entirety of the vehicles in the initial programme, representing the platform's first full industrial deployment.

Sensify is designed as a fluid-free architecture that replaces centralised hydraulic circuits with distributed intelligence at the wheel level. This design allows for the precision control, wherein the system enables continuous and accurate modulation of braking forces to maintain vehicle stability in variable driving conditions. The platform integrates with software-defined vehicle architectures, allowing manufacturers to deploy advanced functions across different vehicle segments. It is engineered to be adaptable with the technology supporting a range of applications from driver assistance systems to fully autonomous vehicles.

Following this production milestone, Brembo has secured additional contracts with new customers for the Sensify platform. The company expects to equip hundreds of thousands of vehicles annually, moving toward large-scale deployment of by-wire braking systems.

Daniele Schillaci, CEO, Brembo, said, “Sensify translates our vision of an intelligent, integrated braking platform into industrial reality. Designed to orchestrate the entire corner ecosystem, it supports safer mobility, while paving the way for the next generation of software-defined vehicles, reflecting our long-term purpose of shaping a Zero Accident Future”.

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Bengaluru-based technology company Tsuyo Manufacturing has been granted two patents for electric vehicle motor designs, increasing its portfolio to 29 innovations.

The company claims it has supplied 300,000 powertrains to 25 manufacturers across the commercial vehicle, agriculture and industrial sectors.

The first patent covers a bridge design for synchronous reluctance motors. This architecture increases torque density and efficiency whilst reducing energy losses and the requirement for rare-earth materials. The second patent focuses on a five-phase permanent magnet motor using a dual inverter system. This technology allows the motor to switch between modes for startup and torque demands and maintains operation if a phase failure occurs.

These technologies were developed through research and collaboration with the Visvesvaraya National Institute of Technology, Nagpur. The company recently received approval from the Government of Karnataka for a manufacturing expansion to increase powertrain production.

Vijay Kumar, Founder and CEO, Tsuyo Manufacturing, said, "These patents mark a significant milestone and recognition in our mission to develop and promote Design-In-India technology for both domestic and global EV markets. At Tsuyo, we are not merely creating components; we are engineering a comprehensive design approach, crafting fundamental technology to drive sustainable and impactful innovation. Our goal is to offer a resilient powertrain system that addresses real-world performance challenges in electric mobility. Our commitment to deep-tech innovation, supported by a strong in-house R&D team and robust academic collaborations, enables us to challenge conventional construction and topology in hardware. This approach allows us to create niche, modular designs that are manufacturable and scalable, delivering solutions that enhance efficiency, reliability, and cost-effectiveness for OEMs. We take pride in being India's fastest research and engineering startup, consistently advancing our research from TRL1 to TRL9 levels. As India moves towards electrification, we are proud to contribute to the 'Design in India, for the world' vision while expanding our IP portfolio with numerous innovations in the pipeline."

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Skoda Auto Volkswagen India (SAVWIPL) has opened a new 33,000 sqft wing at its Technology Centre Pune (TCP) in Baner. The facility is designed to house 250 engineers, bringing the total engineering workforce to more than 450 across its Pune sites.

The expansion aims to increase capacity for vehicle development, platform engineering and software solutions. Staff at the Baner site will also focus on sustainable mobility and connected technologies. This centre acts as a hub for both domestic and international projects within the Volkswagen Group.

The Technology Centre Pune has previously managed the development of models for the Indian market, including the Volkswagen Taigun, the Skoda Kushaq and the Skoda Kylaq sub-4-meter SUV. The new wing is intended to improve localisation and speed up the adaptation of global platforms for local requirements.

Piyush Arora, Managing Director & CEO, Skoda Auto Volkswagen India, said, “The expansion of our R&D footprint in Pune marks another important milestone in our India journey. With the new Baner wing, we are creating additional capacity in a dynamic urban location while building on the strong foundation of our Technology Centre Pune in Chakan. As part of its long-term roadmap, TCP is set to expand its competencies in digitalization, automation, and advanced safety technologies. This combined engineering ecosystem allows us to deliver global-quality solutions with higher speed, greater localisation, and a sharper understanding of customer requirements in India and the world. It further underlines India’s position as a strategic development and competency hub for the Volkswagen Group.”

The company started the Technology Centre Pune in 2019 at its Chakan plant. This latest expansion in Baner is part of a roadmap to increase competencies in automation and safety technologies while maintaining the Group's standards for the subcontinent and export markets.

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