Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions, is set to fully acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for a consideration of up to EUR 42.5 million.

This move Tessolve claims will elevate it to be among a select group of design firms worldwide capable of delivering turnkey design solutions for complex cutting-edge chips. The acquisition will enable it to provide advanced capabilities in terms of System on Chip (SoC) designs for the Artificial Intelligence (AI), automotive, data centre, and industrial markets.

Furthermore, Tessolve will also strengthen its footprint in Europe by adding four delivery locations across Germany and Netherlands, including a specialised ADAS (Advanced Driver Assistance Systems) and imaging centre-of-excellence lab.

Srini Chinamilli, Co-Founder & CEO, Tessolve, said, “This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productisation capabilities. Dream Chip’s capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhances our European footprint.”

Dream Chip Technologies is said to be one of the leading semiconductor design service companies in Germany, particularly for its expertise in complex digital designs.

Jens Benndorf, CEO, Dream Chip Technologies, said, "We are excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. By combining our design capabilities and IP with Tessolve’s established semiconductor services and embedded solutions, we can offer our customers a truly end-to-end solution from chip architecture to post-silicon test and supply chain management for their most complex designs. Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications."

Ujjwal Munjal, Chairman, Tessolve, added, “Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market.”

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NXP Semiconductors has announced that the BMW Group will deploy its Trimension NCJ29D6 Ultra-Wideband (UWB) family across its vehicle fleet, beginning with selected 2026 production programmes.

The hardware component integrates fine-ranging capabilities with short-range radar functionality on a single chip. This allows vehicle manufacturers to utilise a single system for multiple applications, including hands-free vehicle entry and occupant presence detection.

The integration supports BMW’s Digital Key Plus feature, which enables vehicle owners to substitute key fobs with smartphones or smartwatches. The system manages locking and unlocking functions as the user approaches or moves away from the vehicle. Additionally, the technology includes in-cabin radar monitoring designed to identify motion patterns consistent with occupants or animals left inside a parked vehicle, sending notification alerts to users to align with European and Chinese NCAP assessment protocols.

Markus Staeblein, Senior Vice-President and General Manager, Secure Car Access at NXP Semiconductors, said, “NXP’s proven Trimension UWB platform maximises value for OEMs, using a single system to deliver multiple new and differentiating features for drivers. Digital key and presence detection are just the beginning. OEMs will be able to deliver additional UWB-based features, such as kick sensing, intrusion alert or automatic charging, as they establish the secure hardware platform in their vehicles.”

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Envalior India, an engineering materials company formed through the merger of DSM Engineering Materials and LANXESS High Performance Materials, will inaugurate the Envalior Centre of Excellence in Electric Vehicle Technology on 5 August 2026 as part of its corporate social responsibility (CSR) program.

The CoE located at Marathwada Mitra Mandal's Polytechnic in Pimpri-Chinchwad, Pune, will be implemented by the BroadArks Foundation to provide vocational training in electric vehicle systems.

It plans to train 250 individuals annually through two courses: a Level 4 Certificate in EV Service, Safety & Maintenance and a Level 5 Advanced Certificate in EV Diagnostics & Systems.

The curricula align with the National Skills Qualifications Framework and carry certification support from the Confederation of Indian Industry. The programs target students from Industrial Training Institutes and polytechnics studying mechanical, electrical, electronics, mechatronics and computer science disciplines.

Training instruction covers classroom coursework and laboratory modules focused on vehicle architecture, battery management systems, charging infrastructure, thermal management, power electronics, diagnostics and workshop safety protocols. Practical assessments and industry projects form part of the curriculum structure.

Nileshkumar Kukalyekar, Business Director – South Asia, Middle East & Africa, Envalior, said, "The launch of the Envalior Centre of Excellence reflects our commitment to supporting India's transition towards electric mobility by investing in the people who will power it. Through this Centre, we aim to provide students with industry-aligned, hands-on training that prepares them for the evolving demands of the EV sector while contributing to a stronger and future-ready workforce."

In addition to student instruction, the facility is designed to support laboratory infrastructure and instructor development programs for technical education in the region.

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South Korean auto major Hyundai Motor Group has appointed Junghyun Kwon as Executive Vice-President and Head of the Autonomous Driving Development Center.

Kwon will oversee software engineering, deep learning integration, perception systems and commercialisation pathways for the group's autonomous mobility programs, reporting directly to Minwoo Park, President and Head of the Advanced Vehicle Platform (AVP) Division.

He joins the group following technical management roles in software development and artificial intelligence across international technology firms. Kwon previously managed autonomous driving software development and deployment at NVIDIA before directing intelligent robotics development at Samsung Electronics. His technical background covers machine learning models, computer vision systems and vehicle perception frameworks.

The executive appointment forms part of a broader recruitment sequence targeting software-defined vehicle architectures and autonomous driving systems.

Earlier in July, Hyundai Motor Group appointed Dongwuk Kim as Senior Vice-President and Head of the SDV Platform Development Center, following his work on wireless communication systems for mobile devices, robotics and vehicles at Apple and Tesla. The group also added Jeremy Ma as Senior Vice-President and Head of AVP Silicon Valley, drawing on his experience in robotics and autonomous systems at Apple, Toyota Research Institute and NVIDIA.

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Automechanika Frankfurt, one of the leading automotive aftermarket trade fairs, will introduce a technology exchange platform, named ‘HighTech4Mobility’, in September 2026.

The format will address the impact of software-defined vehicles, connected platforms, and artificial intelligence on vehicle maintenance, parts distribution and aftersales business models.

The event will gather original equipment manufacturers, Tier-1 suppliers, software companies, investors and workshop representatives at the Festhalle venue. Program topics encompass software architectures, advanced driver assistance systems, autonomous driving, cybersecurity, data management and digital services. Discussions will evaluate how vehicle data access, over-the-air software updates, and predictive diagnostics alter traditional repair and service workflows.

Olaf Mubhoff, Director, Automechanika Frankfurt, said, “The pace of technological development in the mobility sector is breathtaking. This means it is more important than ever that developments are quickly recognised and understood, so that people can share their experiences and assess the opportunities presented by new technologies. HighTech4Mobility addresses this need by providing a forum for exchange between key industry players.”

The event schedule includes joint presentations on artificial intelligence applications in aftersales by the IBM Institute for Business Value, Google Cloud and the Boston Consulting Group.

Benteler Mobility will present developments in autonomous driving and robotics, while German digital association Bitkom will conduct sessions on cybersecurity in software-defined vehicles. Additionally, the Technical University of Braunschweig will provide two demonstration vehicles to test vehicle monitoring software.

The platform follows a series of pre-fair events, including the HEY/PIONEER receptions in Berlin and Las Vegas, the Innovation4Mobility Talk in Munich and webinars hosted with industry partners.

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