The Autonomous BAJA SAEINDIA 2024 (aBAJA) kicked off with great fanfare, marking the first day of the one-of-a-kind student competition centred on autonomous all-terrain vehicles (AATV).

This 3-day competition (from 4 to 6 October 2024) is hosted by the Automotive Research Association of India (ARAI), Pune, and marks a milestone for BAJA SAEINDIA as autonomous vehicle technology was introduced to the engineering competition. Five teams from throughout the country compete in the event, each of which must complete a unique set of tasks meant to evaluate the performance of their vehicles and teamwork.

Pre-event preparation tests were carried out at ARAI, Kothrud, Pune, from 30 September to 3 October, in the run-up to the tournament. Among these were comprehensive technical examinations, in which vehicles' electrical, mechanical and autonomous systems were carefully assessed to make sure they complied with competition regulations. Assessments of team preparedness and safety briefings were also conducted. To help teams test and improve their autonomous vehicles and make sure they matched the competition's rigorous requirements, trial run tracks were built up for the dynamic events such as Object Detection, Classification and Tracking (ODCT) and Remote Driving System (RDS).

On the first day, static events like the design evaluation and business presentation took main stage. These occasions gave the teams a chance to showcase their creative approaches and intricate designs, emphasising the intricacy and foresight required to create autonomous systems. Teams will test their vehicles' capabilities in real-world scenarios on the second day, which is expected to feature exciting activities that highlight engineering ingenuity and expertise.

Highlighting the significance of hosting the event at ARAI during the welcome address on behalf of ARAI, Ujjwala Karle, Joint Convener, Phase 3 of aBAJA SAEINDIA 2024 & Deputy Director, Technology Group, ARAI, said, “It is an honour for ARAI to host Phase 3 of aBAJA SAEINDIA 2024. This event highlights our commitment to bridging academia and industry. It is inspiring to witness students exhibit the passion and boldness necessary to tackle the complexities of the automotive landscape. BAJA SAEINDIA serves as a vital ‘Introduction to Industry’ (i2i), providing hands-on experience with real-world challenges. Furthermore, initiatives like the iNTELLIMOBILITY Ideathon empower participants to address pressing mobility issues with innovative solutions. We at ARAI are proud to support BAJA SAEINDIA and wish all participants great success in this year’s event.”

Emphasising the importance of technological innovation in shaping the future of mobility, the Chief Guest for the event, Umesh Shah, Managing Director, Autoliv, said, “aBAJA represents a confluence of creativity, engineering, and technology. It is through such initiatives that we inspire the next generation to think beyond conventional solutions and tackle real-world problems with courage and a spirit of innovation. I congratulate the participants for taking up this challenge and encourage them to bring forward their passion and ideas that will shape the mobility landscape in India and beyond. The efforts of the organising committee and all those involved in this competition are commendable. Their dedication ensures that aBAJA continues to be a platform where emerging engineers are not only tested but also encouraged to innovate and grow. I wish all the participants the very best in their endeavours and extend my best wishes to BAJA SAEINDIA as they continue to break new ground with aBAJA SAEINDIA 2025."

Shahkar Abidi, Assistant Editor at Autocar, graced the occasion as the Guest of Honour. Stressing the importance of continuous learning and practical exposure for engineering students, he said, “Autonomous driving and intelligent mobility are no longer just concepts; they are the future. BAJA SAEINDIA has always been ahead of the curve in providing hands-on experiences to students, and aBAJA is a testament to this vision. The passion and drive I see among these students will surely propel them to become future leaders in the automotive industry.”

The grand inaugural ceremony also saw the presence of esteemed dignitaries from both industry and academia, including Ganesh Rao, Director of R&D at Continental; Shantanu Sonar, DGM at Daimler Truck Innovation Centre India (DTICI); Dr P Rajalakshmi from TiHAN, IIT Hyderabad; Balraj Subramaniam, Chairman of the Organising Committee of BAJA SAEINDIA and Saurabh Chitnavis, Joint Convener of aBAJA SAEINDIA 2024.

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  - Dr Kamal Vora October 06, 2024 06:55 AM

  Autonomous BAJA SAEINDIA 2024 is a great initiative of SAEINDIA and I would like to congratulate BAJA Committee members, ARAI, Ajeenkya DY Patil University and all the sponsors & supporters for this initiative. The registration of BAJA SAEINDIA 2024 with early bird incentive starts on 6th Oct 2024 from 8 to 10 pm. For sponsorship or registration, please contact vorakc04@gmail.com

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NXP Semiconductors has introduced the SAF8444, an automotive radar system-on-chip designed to enable advanced driver assistance systems (ADAS) processing on the sensor itself.

Manufactured using 28-nanometre RFCMOS technology, the single-chip solution operates across the 76–81 GHz automotive radar band to support short-, medium- and long-range sensing. The chip is intended for vehicle platforms, including electric vehicles, where it reduces system costs by simplifying thermal management and vehicle integration.

The system addresses entry-level and economy vehicle lines by integrating hardware components to lower overall bill-of-materials costs. It combines an Arm Cortex-A53 applications processor, an Arm Cortex-M7 real-time core, and NXP’s proprietary Signal Processing Toolbox radar accelerator with digital signal processor support. This architecture allows perception-level processing to occur directly on the radar sensor, reducing the data-load reliance on centralised vehicle compute resources.

The technology is optimised for standard automated safety functions, including adaptive cruise control, autonomous emergency braking, blind-spot detection and park assist. To meet safety criteria such as the Euro NCAP 2030 requirements, which include low-light pedestrian detection, the chip fuses camera and radar data.

Additionally, it features a dual-threaded accelerator to run anti-jamming algorithms and mitigate radio frequency interference in congested environments.

NXP supports the device with an enablement ecosystem that includes radar software development kits, safety frameworks, security components, power management integrated circuits, and networking solutions.

Meindert van den Beld, Senior Vice-President and General Manager, Radar & ADAS, NXP Semiconductors, said, “SAF8444 strengthens our one-chip radar portfolio with a solution that balances performance, power efficiency, and cost. It allows customers to meet tightening safety requirements while reducing system cost—an essential step toward democratizing ADAS adoption.”

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German technology company Bosch has officially introduced its third-generation Silicon Carbide (SiC) semiconductors to the Indian market. The strategic rollout targets the next phase of India's electric vehicle (EV) expansion, shifting the market focus from early adoption toward cost efficiency, longer ranges, and mass-market scaling.

Silicon carbide technology has become a cornerstone of modern EV drivetrains, acting as the primary control mechanism for energy flow within the power electronics system – specifically the inverter. By optimising the conversion of direct current (DC) from the battery into alternating current (AC) for the electric motor, SiC chips directly dictate a vehicle's overall electrical efficiency.

The Gen 3 SiC chips bring several structural and performance improvements over legacy silicon and previous-generation components by delivering around 20 percent higher performance, enabling electric vehicles to achieve extended driving ranges without requiring automakers to increase physical battery pack sizes.

The SiC chips are manufactured using an advanced substrate, which reduces switching energy losses and improves thermal performance. This allows for less complex, more lightweight cooling architectures within the engine bay.

Enhanced miniaturisation allows Bosch to harvest more individual chips per semiconductor wafer, lowering manufacturing cost barriers and making advanced power electronics financially viable for mass-market budget EVs, two-wheelers and commercial fleets.

To date, Bosch has delivered more than 60 million SiC chips worldwide. The multinational engineering firm continues to funnel billions of euros into expanding its global semiconductor fabrication plants to reinforce supply line resilience against global automotive chip shortages.

By introducing the third-generation lineup locally, Bosch aims to establish an end-to-end semiconductor ecosystem in India, backing the government's localized advanced manufacturing and vehicle electrification goals.

Sandeep Nelamangala, Joint Managing Director, Bosch and President of Bosch Mobility India, said, “Our advanced SiC technology is designed to deliver the tangible benefits that Indian consumers demand - longer driving range, faster charging, and lower long-term costs. By making high-efficiency power electronics more accessible, we are helping to unlock the full potential of the EV market, making clean, efficient mobility a reality for everyone in India."

Markus Heyn, Member of the Bosch Board of Management, and Chairman, Bosch Mobility business sector, said, “Our ambition is clear: we want to be a globally leading manufacturer of SiC chips. With our next generation SiC chips, we are helping our customers put even more powerful and efficient electric vehicles onto the road.”

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BYD India, a subsidiary of the world’s largest New Energy Vehicle (NEV) manufacturer, has showcased its DM-i (Dual Mode Intelligent) plug-in hybrid technology in India. Positioned as a transitional bridge between internal combustion engines and pure battery electric vehicles (BEVs), the incoming powertrain technology targets long-haul efficiency with a combined cruising range exceeding 1,200 km.

With a global plug-in hybrid history starting with the F3DM in 2008, BYD has amassed over 8 million cumulative PHEV sales, capturing a 35 percent global market share in the segment. The technology's introduction in India is intended to expand BYD's domestic portfolio beyond its current pure-EV lineup, which serves a growing base of 14,000 customers via 48 showrooms across 40 cities.

Unlike conventional hybrids that rely on a petrol engine as the primary mover with electric motors acting as secondary support, BYD's DM-i architecture reverses this layout to operate as an Electric-First system.

The vehicle relies primarily on battery power across everyday urban commutes. The petrol engine operates secondary to propulsion, working as a silent generator to maintain battery state-of-charge or engaging directly only during high-load, high-speed scenarios.

The system manages energy distribution via three intelligent operating modes:

• EV Mode: The vehicle relies entirely on the electric motor and battery pack, mimicking a standard BEV for zero-emission city driving.
• HEV ‘Series’ Mode: For mid-range driving, the onboard engine acts strictly as a generator, supplying electricity to charge the battery while the electric motor continues to turn the wheels.
• HEV ‘Parallel’ Mode: Under heavy acceleration or high-speed cruising, the petrol engine mechanically couples to the drivetrain, providing direct propulsion to the wheels alongside the electric motor.

The DM-i platform pairs advanced electric motor hardware with a highly specialised internal combustion engine optimised for thermal cycling:

• Xiaoyun 1.5L Engine: The platform utilises a dedicated 1.5-litre naturally aspirated petrol engine that achieves an industry-leading thermal efficiency of 43.04 percent.
• Super Hybrid Blade Battery: Power is stored in a specialised iteration of BYD's proprietary Lithium Iron Phosphate (LFP) Blade Battery, engineered for structural safety, puncture resistance and high thermal stability.
• Fuel Economy: Under standard test conditions, the powertrain achieves a low consumption rate of 4.8-litre per 100 km (approximately 20.8 kmpl).
• Acceleration: The Electric Hybrid System (EHS) delivers seamless, single-speed acceleration, enabling a zero to 100 kmph sprint time of under 5.5 seconds in its high-performance configurations.

Initially entering India in 2007 to build electric buses and commercial chassis, BYD India has scaled its passenger vehicle presence with models including the e6, Atto 3, Seal, eMax 7 and Sealion 7. The company supports its local assembly operations through two manufacturing facilities spanning over 140,000 square meters, representing an investment of more than USD 200 million.

Rajeev Chauhan, Head of the Electric Passenger Vehicles Business, BYD India, said, "The introduction of DM-i technology marks a pivotal step in our commitment to making sustainable mobility more versatile and accessible for Indian consumers. By enabling electric-first driving for daily use while seamlessly supporting long-distance travel, DM-i addresses some of the most pressing barriers to the adoption of sustainable motoring in India. With this innovation, we are bringing a new technology to Indian consumers, and also shaping a smarter, more flexible pathway towards sustainable transportation."

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Astemo Americas, Inc. has announced its collaboration with NVIDIA as a DRIVE Hyperion Tier-1 partner. The company will focus on developing electronic control units (ECUs) utilising dual NVIDIA DRIVE AGX Thor systems-on-a-chip (SoCs) to support the automotive industry's ongoing shift toward software-defined, Level 4-ready autonomous vehicles.

NVIDIA DRIVE Hyperion serves as a production-ready reference architecture and ecosystem designed to help automakers streamline the deployment of highly automated and fully autonomous driving technologies.

Astemo Americas' engineering integration focuses on building a dual-SoC compute engine capable of handling the severe data workloads required by next-generation vehicle platforms. The collaboration pairs specialised high-performance artificial intelligence (AI) computing with optimised thermal and power management.

The partnership expands Astemo Americas' traditional footprint as a tier-one component supplier, shifting it into a primary integration partner for advanced autonomous system infrastructure. By combining its existing background in electric powertrains, active chassis systems and engine management with NVIDIA’s AI processing units, the company aims to provide global automakers with scalable, production-ready central computing nodes that bridge the gap between experimental development and high-volume vehicle production.

Mathieu Devillard, Executive Vice-President and Head of the Electrification Business Division, Astemo, said, “Astemo’s electrification and software-defined vehicle capabilities are central to where mobility is headed. By joining the NVIDIA DRIVE Hyperion ecosystem, we can help accelerate the development of advanced autonomous vehicle technologies while supporting automakers with scalable, cost-effective solutions.”

Rishi Dhall, Vice-President – Automotive, NVIDIA, added, “As a DRIVE Hyperion Tier-1 ecosystem partner developing dual NVIDIA DRIVE AGX Thor ECUs for automotive OEMs, Astemo is helping bring scalable autonomous driving platforms closer to production.”

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