TVS Mobility has announced an employee exchange programme with Mitsubishi Corporation (MC), a globally integrated business enterprise with a network of around 1,700 group companies. 

The programme is called as TVS Mobility Mitsubishi Employee Exchange Program (TMMEEP) and will facilitate an arrangement where MC (Japan) hosts TVS Mobility employees with an intention to upskill them, to train them automotive and mobility sector in aspects such as inspection in auctions, service mechanics, etc. 

TVS Mobility, on the other hand will host employees from MC and provide them insights in the digital deployment in aftermarket business. Employees under 45 years of age with over three years of service with TVS Mobility Group and Mitsubishi Corporation would be eligible for the exchange programme.

A first-of-its-kind initiative, TMMEEP is designed to foster mutual growth and innovation; to facilitate seamless cross-learning, enhance skill, domain knowledge and sharing business management expertise besides training the next generation of leaders within the two organisations.

Commenting on the programme, R Dinesh, Director, TVS Mobility Group, said, “We are excited to embark on this journey with Mitsubishi Corporation as there is a huge scope to address skill gaps and share best practices between the two organisations. Further, this platform will enable us to leverage our synergies and identify mutually beneficial projects and initiatives, which could be explored through this two-way cooperation. I am sure this program, through cross learning, will propel both companies to achieve greater heights and collaborative success.”

Wakabayashi, Executive Vice President & Mobility Group CEO, Mitsubishi Corporation, mentioned, "We are pleased to expand mobility business in the Indian market together with the TVS Mobility Group, who has a long history, a proven track record and is trusted by customers. Since we began collaborating with TVS Mobility in 2018 on the TASL/Ki (Automotive spare parts distribution and after-sales service) business, we have strengthened, expanded and deepened our relationship including our recent announcement to join hands with TVS VMS for multi-brand dealership business. With this mutual personnel exchange program, we hope that employees of both companies will not only acquire skills, know-how and expertise, but also gain a deeper understanding of each other's cultures, and contribute to the development of both companies and the development of Japan-India relations over the long term."

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NXP Semiconductors has introduced the SAF8444, an automotive radar system-on-chip designed to enable advanced driver assistance systems (ADAS) processing on the sensor itself.

Manufactured using 28-nanometre RFCMOS technology, the single-chip solution operates across the 76–81 GHz automotive radar band to support short-, medium- and long-range sensing. The chip is intended for vehicle platforms, including electric vehicles, where it reduces system costs by simplifying thermal management and vehicle integration.

The system addresses entry-level and economy vehicle lines by integrating hardware components to lower overall bill-of-materials costs. It combines an Arm Cortex-A53 applications processor, an Arm Cortex-M7 real-time core, and NXP’s proprietary Signal Processing Toolbox radar accelerator with digital signal processor support. This architecture allows perception-level processing to occur directly on the radar sensor, reducing the data-load reliance on centralised vehicle compute resources.

The technology is optimised for standard automated safety functions, including adaptive cruise control, autonomous emergency braking, blind-spot detection and park assist. To meet safety criteria such as the Euro NCAP 2030 requirements, which include low-light pedestrian detection, the chip fuses camera and radar data.

Additionally, it features a dual-threaded accelerator to run anti-jamming algorithms and mitigate radio frequency interference in congested environments.

NXP supports the device with an enablement ecosystem that includes radar software development kits, safety frameworks, security components, power management integrated circuits, and networking solutions.

Meindert van den Beld, Senior Vice-President and General Manager, Radar & ADAS, NXP Semiconductors, said, “SAF8444 strengthens our one-chip radar portfolio with a solution that balances performance, power efficiency, and cost. It allows customers to meet tightening safety requirements while reducing system cost—an essential step toward democratizing ADAS adoption.”

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German technology company Bosch has officially introduced its third-generation Silicon Carbide (SiC) semiconductors to the Indian market. The strategic rollout targets the next phase of India's electric vehicle (EV) expansion, shifting the market focus from early adoption toward cost efficiency, longer ranges, and mass-market scaling.

Silicon carbide technology has become a cornerstone of modern EV drivetrains, acting as the primary control mechanism for energy flow within the power electronics system – specifically the inverter. By optimising the conversion of direct current (DC) from the battery into alternating current (AC) for the electric motor, SiC chips directly dictate a vehicle's overall electrical efficiency.

The Gen 3 SiC chips bring several structural and performance improvements over legacy silicon and previous-generation components by delivering around 20 percent higher performance, enabling electric vehicles to achieve extended driving ranges without requiring automakers to increase physical battery pack sizes.

The SiC chips are manufactured using an advanced substrate, which reduces switching energy losses and improves thermal performance. This allows for less complex, more lightweight cooling architectures within the engine bay.

Enhanced miniaturisation allows Bosch to harvest more individual chips per semiconductor wafer, lowering manufacturing cost barriers and making advanced power electronics financially viable for mass-market budget EVs, two-wheelers and commercial fleets.

To date, Bosch has delivered more than 60 million SiC chips worldwide. The multinational engineering firm continues to funnel billions of euros into expanding its global semiconductor fabrication plants to reinforce supply line resilience against global automotive chip shortages.

By introducing the third-generation lineup locally, Bosch aims to establish an end-to-end semiconductor ecosystem in India, backing the government's localized advanced manufacturing and vehicle electrification goals.

Sandeep Nelamangala, Joint Managing Director, Bosch and President of Bosch Mobility India, said, “Our advanced SiC technology is designed to deliver the tangible benefits that Indian consumers demand - longer driving range, faster charging, and lower long-term costs. By making high-efficiency power electronics more accessible, we are helping to unlock the full potential of the EV market, making clean, efficient mobility a reality for everyone in India."

Markus Heyn, Member of the Bosch Board of Management, and Chairman, Bosch Mobility business sector, said, “Our ambition is clear: we want to be a globally leading manufacturer of SiC chips. With our next generation SiC chips, we are helping our customers put even more powerful and efficient electric vehicles onto the road.”

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BYD India, a subsidiary of the world’s largest New Energy Vehicle (NEV) manufacturer, has showcased its DM-i (Dual Mode Intelligent) plug-in hybrid technology in India. Positioned as a transitional bridge between internal combustion engines and pure battery electric vehicles (BEVs), the incoming powertrain technology targets long-haul efficiency with a combined cruising range exceeding 1,200 km.

With a global plug-in hybrid history starting with the F3DM in 2008, BYD has amassed over 8 million cumulative PHEV sales, capturing a 35 percent global market share in the segment. The technology's introduction in India is intended to expand BYD's domestic portfolio beyond its current pure-EV lineup, which serves a growing base of 14,000 customers via 48 showrooms across 40 cities.

Unlike conventional hybrids that rely on a petrol engine as the primary mover with electric motors acting as secondary support, BYD's DM-i architecture reverses this layout to operate as an Electric-First system.

The vehicle relies primarily on battery power across everyday urban commutes. The petrol engine operates secondary to propulsion, working as a silent generator to maintain battery state-of-charge or engaging directly only during high-load, high-speed scenarios.

The system manages energy distribution via three intelligent operating modes:

• EV Mode: The vehicle relies entirely on the electric motor and battery pack, mimicking a standard BEV for zero-emission city driving.
• HEV ‘Series’ Mode: For mid-range driving, the onboard engine acts strictly as a generator, supplying electricity to charge the battery while the electric motor continues to turn the wheels.
• HEV ‘Parallel’ Mode: Under heavy acceleration or high-speed cruising, the petrol engine mechanically couples to the drivetrain, providing direct propulsion to the wheels alongside the electric motor.

The DM-i platform pairs advanced electric motor hardware with a highly specialised internal combustion engine optimised for thermal cycling:

• Xiaoyun 1.5L Engine: The platform utilises a dedicated 1.5-litre naturally aspirated petrol engine that achieves an industry-leading thermal efficiency of 43.04 percent.
• Super Hybrid Blade Battery: Power is stored in a specialised iteration of BYD's proprietary Lithium Iron Phosphate (LFP) Blade Battery, engineered for structural safety, puncture resistance and high thermal stability.
• Fuel Economy: Under standard test conditions, the powertrain achieves a low consumption rate of 4.8-litre per 100 km (approximately 20.8 kmpl).
• Acceleration: The Electric Hybrid System (EHS) delivers seamless, single-speed acceleration, enabling a zero to 100 kmph sprint time of under 5.5 seconds in its high-performance configurations.

Initially entering India in 2007 to build electric buses and commercial chassis, BYD India has scaled its passenger vehicle presence with models including the e6, Atto 3, Seal, eMax 7 and Sealion 7. The company supports its local assembly operations through two manufacturing facilities spanning over 140,000 square meters, representing an investment of more than USD 200 million.

Rajeev Chauhan, Head of the Electric Passenger Vehicles Business, BYD India, said, "The introduction of DM-i technology marks a pivotal step in our commitment to making sustainable mobility more versatile and accessible for Indian consumers. By enabling electric-first driving for daily use while seamlessly supporting long-distance travel, DM-i addresses some of the most pressing barriers to the adoption of sustainable motoring in India. With this innovation, we are bringing a new technology to Indian consumers, and also shaping a smarter, more flexible pathway towards sustainable transportation."

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Astemo Americas, Inc. has announced its collaboration with NVIDIA as a DRIVE Hyperion Tier-1 partner. The company will focus on developing electronic control units (ECUs) utilising dual NVIDIA DRIVE AGX Thor systems-on-a-chip (SoCs) to support the automotive industry's ongoing shift toward software-defined, Level 4-ready autonomous vehicles.

NVIDIA DRIVE Hyperion serves as a production-ready reference architecture and ecosystem designed to help automakers streamline the deployment of highly automated and fully autonomous driving technologies.

Astemo Americas' engineering integration focuses on building a dual-SoC compute engine capable of handling the severe data workloads required by next-generation vehicle platforms. The collaboration pairs specialised high-performance artificial intelligence (AI) computing with optimised thermal and power management.

The partnership expands Astemo Americas' traditional footprint as a tier-one component supplier, shifting it into a primary integration partner for advanced autonomous system infrastructure. By combining its existing background in electric powertrains, active chassis systems and engine management with NVIDIA’s AI processing units, the company aims to provide global automakers with scalable, production-ready central computing nodes that bridge the gap between experimental development and high-volume vehicle production.

Mathieu Devillard, Executive Vice-President and Head of the Electrification Business Division, Astemo, said, “Astemo’s electrification and software-defined vehicle capabilities are central to where mobility is headed. By joining the NVIDIA DRIVE Hyperion ecosystem, we can help accelerate the development of advanced autonomous vehicle technologies while supporting automakers with scalable, cost-effective solutions.”

Rishi Dhall, Vice-President – Automotive, NVIDIA, added, “As a DRIVE Hyperion Tier-1 ecosystem partner developing dual NVIDIA DRIVE AGX Thor ECUs for automotive OEMs, Astemo is helping bring scalable autonomous driving platforms closer to production.”

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