TVS Mobility has announced an employee exchange programme with Mitsubishi Corporation (MC), a globally integrated business enterprise with a network of around 1,700 group companies. 

The programme is called as TVS Mobility Mitsubishi Employee Exchange Program (TMMEEP) and will facilitate an arrangement where MC (Japan) hosts TVS Mobility employees with an intention to upskill them, to train them automotive and mobility sector in aspects such as inspection in auctions, service mechanics, etc. 

TVS Mobility, on the other hand will host employees from MC and provide them insights in the digital deployment in aftermarket business. Employees under 45 years of age with over three years of service with TVS Mobility Group and Mitsubishi Corporation would be eligible for the exchange programme.

A first-of-its-kind initiative, TMMEEP is designed to foster mutual growth and innovation; to facilitate seamless cross-learning, enhance skill, domain knowledge and sharing business management expertise besides training the next generation of leaders within the two organisations.

Commenting on the programme, R Dinesh, Director, TVS Mobility Group, said, “We are excited to embark on this journey with Mitsubishi Corporation as there is a huge scope to address skill gaps and share best practices between the two organisations. Further, this platform will enable us to leverage our synergies and identify mutually beneficial projects and initiatives, which could be explored through this two-way cooperation. I am sure this program, through cross learning, will propel both companies to achieve greater heights and collaborative success.”

Wakabayashi, Executive Vice President & Mobility Group CEO, Mitsubishi Corporation, mentioned, "We are pleased to expand mobility business in the Indian market together with the TVS Mobility Group, who has a long history, a proven track record and is trusted by customers. Since we began collaborating with TVS Mobility in 2018 on the TASL/Ki (Automotive spare parts distribution and after-sales service) business, we have strengthened, expanded and deepened our relationship including our recent announcement to join hands with TVS VMS for multi-brand dealership business. With this mutual personnel exchange program, we hope that employees of both companies will not only acquire skills, know-how and expertise, but also gain a deeper understanding of each other's cultures, and contribute to the development of both companies and the development of Japan-India relations over the long term."

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Bengaluru-based ride-hailing company Ola Consumer has launched its non-AC ride category across India, becoming the only player in the country to offer this option at scale.

The company stated that the goal is to offer customers maximum choice across various price points to meet their travel needs. The new category will also enable cab drivers to have lower fuel consumption and improve their earnings.  

Ola Consumer spokesperson said: “With the non-AC category, we’re pushing the boundaries of how affordable and accessible urban mobility can be in India. Millions of people rely on daily, value-driven transport, and this offering is built entirely around their needs. The early response has been incredible and shows how strongly India wants more transparent, flexible, and fairly priced mobility. This move marks a step ahead in our mission to rethink mobility in India, and make it truly inclusive for every consumer.”

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Synopsys, in association with 3D Engineering (an Ansys Elite Channel Partner), has inaugurated a new Design Center for Engineering Simulation at the MCCIA Electronic Cluster Foundation (MECF) in Pune.

The facility aims to accelerate access to advanced simulation technologies for MSMEs and be a catalyst for industrial R&D in Tier 2 and Tier 3 cities, industry-academia collaboration and student training.

The Design Center will enhance simulation-led innovation and adoption in electronic product design engineering for MSMEs in automotive, aerospace and defence, electronics and healthcare.

The facility will provide hands-on access to engineering tools in structural analysis, thermal modelling, electromagnetics and digital twin technologies. It is equipped with licensed Ansys (now part of Synopsys) simulation platforms and a high-performance computing (HPC) infrastructure.

The MECF facility is one of the Common Facility Centers (CFCs) approved by the Ministry of Electronics and Information Technology (MeitY), valued at INR 710 million. MECF is promoted by the Mahratta Chamber of Commerce, Industries and Agriculture (MCCIA).

This initiative aligns with India's goals under 'Make in India' and 'Skill India' by enabling simulation-led R&D, accelerating time-to-market for local manufacturing innovations and building a talent pipeline trained in engineering challenges.

It will serve as a dual-purpose hub for skill development and industry consultancy, offering design, simulation services and hands-on training. It will also bridge the cost and resource gap for smaller enterprises by offering discounted access to design tools and expert support.

Mike Yeager, Area Vice-President, Synopsys, said, “Simulation is a foundation of modern engineering, and we believe in making these powerful tools accessible everywhere in India. Our collaboration with 3D Engineering and MECF, supported by the Ministry of Electronics and Information Technology (MeitY), will empower students, startups, and SMEs to leapfrog into next-generation design and innovation.”

Murali Pullela, Area Sales Director, Synopsys, said, “Our collaboration with MECF reflects the company's commitment to empower innovation from silicon-to-systems. By equipping the design center with advanced engineering tools, India’s electronics ecosystem can be strengthened, accelerating product development aligned with global standards.”

Shrikrishna Gadgil, CEO, MECF, said, “MECF helps the industry in their product development cycle from design to certification, which will support the electronics ecosystem in the region. Our vision is to make the region vibrant with innovation, fostering new products and technologies, and establishing it as a hub for futuristic products and a center of technology excellence. We’re committed to bringing world-class technology and infrastructure closer to grassroots engineering talent. For us, this Design Center by 3D Engineering with Synopsys, as the principal partner is not just an investment in infrastructure, but also an investment in people, capability-building, and future innovation.”

Ajay Deshkar, Managing Partner, 3D Engineering, said, “As a long-standing Ansys Channel Partner, we at 3D Engineering are proud to enable this ecosystem where cutting-edge simulation technology meets local ingenuity. This Design Center is a model for how industry partnerships can meaningfully drive regional innovation and contribute to India’s technological self-reliance.”

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Nvidia and Synopsys, Inc. have announced an expanded, strategic partnership to revolutionise design and engineering across industries. The collaboration aims to integrate Nvidia's AI and accelerated computing with Synopsys' engineering solutions to help research and development teams design, simulate and verify intelligent products with greater precision and speed.

Furthermore, Nvidia invested USD 2 billion in Synopsys common stock at a purchase price of USD 414.79 per share as part of the multi-year collaboration. The partnership is targeted at R&D teams across the semiconductor, aerospace, automotive and industrial sectors that face challenges including workflow complexity, development costs and time-to-market pressure.

Jensen Huang, Founder and CEO, Nvidia, said, “CUDA GPU-accelerated computing is revolutionising design – enabling simulation at unprecedented speed and scale, from atoms to transistors, from chips to complete systems, creating fully functional digital twins inside the computer. Our partnership with Synopsys harnesses the power of Nvidia accelerated computing and AI to reimagine engineering and design – empowering engineers to invent the extraordinary products that will shape our future.”

Sassine Ghazi, President and CEO, Synopsys, said, “The complexity and cost of developing next-generation intelligent systems demands engineering solutions with a deeper integration of electronics and physics, accelerated by AI capabilities and compute. No two companies are better positioned to deliver AI-powered, holistic system design solutions than Synopsys and Nvidia. Together we will re-engineer engineering and empower innovators everywhere to more efficiently realise their innovations.”

The multi-year partnership builds on existing collaborations and includes the following initiatives:

• Broad Application Acceleration: Synopsys will accelerate and optimise its portfolio of compute-intensive applications, spanning chip design, physical verification, molecular simulations, electromagnetic analysis and optical simulation, using Nvidia CUDA-X libraries and AI-Physics technologies.
• Agentic AI Engineering: The companies are integrating Synopsys AgentEngineer technology with the Nvidia Agentic AI technology stack – including Nvidia NIM microservices, Nvidia NeMo Agent Toolkit software, and Nvidia Nemotron models – to enable autonomous design capabilities for EDA and simulation and analysis workflows.
• Digital Twins: Collaboration will enable virtual design, testing and validation through the use of accurate digital twins for industries such as semiconductor, robotics, aerospace, and automotive. These solutions will utilise Nvidia Omniverse, Nvidia Cosmos and other technologies.
• Cloud-Ready Solutions: Synopsys and Nvidia plan to enable cloud access for GPU-accelerated engineering solutions.
• Go-to-Market Initiatives: The companies have agreed to develop joint go-to-market initiatives to reach engineering teams across multiple industries with both on-premise and cloud-ready solutions. This effort will utilise Synopsys' global network of sellers and channel partners.

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TrinamiX and Aumovio will demonstrate a non-invasive blood alcohol measurement solution for private and commercial vehicles at CES 2026 in Las Vegas. The technology is designed to enhance road safety and address regulatory demand for driver-monitoring systems. The system enables real-time measurement of blood alcohol concentration by touching a sensor with a fingertip.

The technology uses invisible near-infrared light that interacts with ethanol molecules present in the tissue under the skin. By analysing the reflection of this light, the system’s algorithms based on AI can derive the alcohol content in a person’s blood. The functionality and performance of this technology have been scientifically validated through a clinical study.

TrinamiX provides expertise in spectroscopy and optical sensing, while Aumovio offers know-how in vehicle system design and integration. The system can be configured to meet different market requirements and threshold levels.

The miniaturised NIR spectroscopy sensor offers convenience and features:

• Non-Invasive Convenience: Touch-based, eliminating the need for users to blow into a device.
• Real-Time Readings: Results are delivered in seconds to ensure operational efficiency.
• Seamless Integration in Vehicles: Compact and adaptable for various vehicle positions to encourage user acceptance.
• Automotive System Design and Integration: Provided through partnership with Aumovio.

Wilfried Hermes, Director Consumer Electronics & Automotive EU & NA, TrinamiX, said, “Our NIR spectroscopy technology offers a reliable, user-friendly way to measure blood alcohol levels, redefining driver safety standards. By providing OEMs with a vital tool to meet emerging safety regulations, we’re empowering a safer and more convenient future for all road users.”

Ulrich Luders, Director Strategy & Portfolio, User Experience business unit at Aumovio, said, "The integration of TrinamiX's NIR spectroscopy, for example into vehicle displays, enables innovative safety and health features directly in the car. With this we create new standards for comfort and safety and demonstrate how such technologies can be seamlessly integrated into existing systems."

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